Sent an xbox down to a friend after doing a RROD repair on it, and the game kept freezing and then he got the E74 error. What I would like to try is for him to get one of the clip on fan packs which I think should stop the overheating issue, When I did the fix I let it overheat then sealed the heat sinks down, and the console has been sitting flat and not moved around so I don't think the chips would have come loose.
Is there a fan to reset the error or is overheating the only way to do it, as he wont be able to open the case, I was thinking instead of the towel trick, how about putting toothpicks into the fans then turning it on and letting it over heat for a few minutes, let the solder flow, cool it off for an hour then put the fan pack on. what do you guys think?
I should note the other consoles that i have done the exact same trick with work fine without ever freezing. although I didnt do the card trick with his one.
Originally posted by leerage: DON'T DO THE TOWEL TRICK!!
E74 is an issue with the ANA/HANA chip. You will need to get that reflowed to effectively rid the XBOX 360 of that error.
Don't worry I wont!
When you say do the reflow are you meaning by letting it overheat for a few minutes as in a lot of repair guides, or actually taking it in to someone who has the reflow station?
I did the first method, and that seemed to have reasonable success, I just let it overheat by unplugging the fans and letting it run. So I thought if you could block the fans through the case it would have the same effect as doing a reflow..?
Originally posted by leerage: I mean having someone use a reflow machine on the ANA/HANA chip.
Ok, unfortunately no-one in my area does it with a proper reflow station (just a heatgun).
Is there much difference between letting the console overheat itself whilst out of the cage and using a heat gun to reflow the solder?
With a reflow machine, you can adjust the heat precisely and concentrate in one specific spot. With a heat gun, you are likely to ruin your motherboard.
Originally posted by leerage: I mean having someone use a reflow machine on the ANA/HANA chip.
Ok, unfortunately no-one in my area does it with a proper reflow station (just a heatgun).
Is there much difference between letting the console overheat itself whilst out of the cage and using a heat gun to reflow the solder?
With a reflow machine, you can adjust the heat precisely and concentrate in one specific spot. With a heat gun, you are likely to ruin your motherboard.
thought so. Even MS have to send the repairs off shore as there aren't any of the big reflow stations in the country.
