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YLOD - Reflow Fix Suggestions.
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wildwild1
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15. January 2010 @ 01:55 _ Link to this message    Send private message to this user   
Hi all,

I believe you guys have not applied enough heat to actually reflow the BGAs. You need to heat the solder balls to at least 235C for ~15S for a successful reflow.

To achieve this you need:

1) use liquid flux,
2) warm the BGA to ~200C for 60-120s,
3) step up the heat to get the BGA to 250C for 15-30s (it may need heat of ~300-350C), use too much heat and you will damage the BGA and other components. DO NOT MOVE OR TOUCH the PCB.
4) back off the heat as quickly as you can and cool down the BGA. Let it rest for a while and re-assemble the PS3.

Hopefully you have a longer lasting PS3 :)

If not repeat the reflow process and use longer heating time in step 3) to get the solder balls reflowed properly.

Good luck to all. Any suggestion is welcome :)

Wildy.
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