What is the best application method on applying thermal compound to the PS3 RSX GPU and The Cell BE CPU? These youtube video show excellent view on how various thermal compounds and methods spread. None of the videos show the new Arctic Cooling MX-3 tho and was wondering if anyone has used this compound before and what method was used?
Best way for a lot of people is to squeeze a small amount onto the center of the area, and then apply heat sink, which will distribute the compound. Manually spreading around the compound will allow air pockets to form, and this will cause inefficient heat transfer. I suppose this method can be argued, but a lot of people will agree. Search around and you will find this method preferred by experienced technicians and professionals.
I messaged the creator of those videos and this was his response for the best method on the PS3.
Given the large surface area of the GPU and CPU, i would suggest u use the spread method. because we dont know the size of the "die" inside the GPU and CPU square metal. So it is better to use spread method. As long as these are some thermal paste on it, it will be fine. Please practise installing the heatsink back without thermal paste 1st. Once u familiar with the installation, then proceed to apply the paste.
just curious as to his credentials... computer engineering here, and I spoke with technicians that work with heat sinks and thermal paste daily. Try googling it?
I?ve been doing it for 18 years as an Electronic Technician / Industrial Electrician. I use a Spatula to (Very Thinly) spread it.
Some seam to think that Thermo Compound is a Magic substance that will absorb heat and the more that I put on, the better it will work. Not. It is only to fill the imperfections in the two mating materials as to make the two into one material so the heat can transfer from one to the other. As you stated, bubbles would be horrible. Then again, there should never be enough paste applied to the heat sink to allow a bubble to exist in the first place.
I agree. Proper spreading, similar to that of crack filling = an even layer spread with minimal passes. I have seen some pictures of people "spreading" it that looked like a bagel & cream cheese from a cheap donut shop. I guess I was imagining in my own head the application I use it on: X-box 360 x-clamp replacement. The heat sink is bolted to mobo, so it is "thinned" and spread as it is tightened down with the bolts. An application where the heat sink isn't applied with so much force would definitely benefit more from the spreading technique...done properly. Cheers man.
